Advanced Laminates

Metallization on Si-Hy-PI

RTR Manufacturing

Properties

Advantages

• The interlayer roughness of a product prepared by the direct electroless plating method is very small.
  advantage to high frequency transmission


• The copper thickness is adjustable.
  advantage to fine-pitch formation
  shortening of etching time
  applicable to semi-additive process

Pre-drilled Metallization

• Laser drill on PI energy saving 90% compare with drilling on Cu foil FCCL.


• PI Laser punch type drill speed is around 4 times higher than Laser circle type drilling on Cu FCCL.


• Through hole or fully filled hole is easily selectable.

Features & Advantages

1. Super Thin Copper Thickness
   => Thinner Copper gives better etching factor, fold ability, and fine pitch capability.


2. Ultra Low Roughness Profile of Copper
   => Nano scale Copper Profile provides better Circuit Conductivity and lower Impedance, good for high frequency circuit design.


3. Excellent Peel Strength Stability
   => Nano size anchors between PI and Copper contribute good peel strength after Heat Aging.


4. Excellent Dimension Stability
   => CTE of Pomiran PI film is design to match Copper, more than that, wet process direct metallization on PI film provides very low thermo stress.


5. Unique Pre-drilled Capability
   => Not only shorten the FPC manufacturing processes and save cost, but also reduce the waste of the earth's resources.