PalPilot’s manufacturing division offers solutions to meet your needs no matter the mix or volume. Our experienced sales teams will help every step of the way from design to development; and our offshore factories afford us production capacity to meet projects of all sizes. Business moves fast, that’s why we pride ourselves in offering quick turnaround (5-10 days from Asia), so you can meet aggressive deadlines. Common types of PCB production we offer include: High Mix Low Volume (HMLV) Production For Low and High technology PCB’s, Medium Volume Production 1-40 layer, High Volume Production 1-40 Layer, Flex and Rigid Flex, Prototype, small, medium, and high volume production.

Our team recognizes the importance of supply and demand; each task is carefully executed. The significance of our component supply chain demonstrates our ability to adapt to the ever-changing dynamics of the electronics industry. Learn more about our Component Supply Chain service.

PalPilot Value Solutions

  • Experienced Sales Team
  • Complete PCB supply chain
  • Design, development, and production capacity
  • Broad spectrum of technologies and capabilities
  • Multiple manufacturing locations with single contact window
  • Engineering, customer service, and quality interface in USA, Taiwan, and China

PalPilot was formed in Taiwan to provide PCB design to a growing marketplace of Original Design Manufacturers targeting PCB Motherboard Design. Utilizing the top design software platform, Cadence Allegro, PalPilot was able to focus on fast, high density, and routing. In the 90’s PalPilot expanded by opening three new locations, San Jose CA, Fu Jian China, and Tustin CA.

  • Standard Tg FR-4
  • Mid Tg FR-4
  • High Tg FR-4
  • High Speed Materials –  Rogers –  Taconic –  Nelco
  • Mixed Dielectric Constructions
  • Halogen Free
  • High CTI
  • Polyimide (adhesive, adhesiveless)
  • PET / Polyester
  • Metal Cores

  • Leaded HASL
  • Lead Free HASL
  • Immersion Gold (ENIG)
  • Immersion Gold (ENEPIG)
  • Immersion Silver
  • Immersion Tin
  • Hard Gold (Fingers)
  • Selective Hard Gold
  • Wire Bondable Soft Gold
  • Flash Gold
  • OSP
  • Carbon Ink


Rigid PCB

Layers 1-40(layers)
Max Board Size 24” x 40”
Max Board Thickness .315″
Min Board Thickness 4 layers 16mil
6 layers 24mil
8 layers 40mil
10 layers 48mil
12~16 layers 63mil
HDI Boards Blind, Buried & Stacked Vias
Min Line Width 3mil
Min Line Space 3mil
Min Mechanical Drill / Pad 3mil / 16mil
Min Laser Drill / Pad 4mil / 10mil
PTH Dia. Tolerance ±3mil
NPTH Dia. Tolerance ±1mil
Hole Position Deviation ±3mil
Outline Tolerance ±3mil
Solder Mask Dams 3mil
Aspect Ratio Mechanical 15.1
Aspect Ratio Laser 1 : 1
Flammability 94V-0
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%


Layers 1-8(layers)
Max Board Size 8.6” x 13.8”
Max Board Thickness .031″ without stiffener
Min Board Thickness 4mil
Min Line Width 3mil
Min Line Space 3mil
Min Mechanical Drill / Pad 6mil
Outline (Laser) Tolerance ±2mil
Cover Layer Dams 8mil
Flammability 94V-0
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%


  • Bilingual engineering support in the US and Asia to bring the service point close to our customer
  • A comprehensive engineering process to ensure accurate front end tooling while reducing the impact on delivery
  • Experienced program managers in Asia to work with our factories to solve DFM hurdles
  • Experience with both Asian based and US based Copper Clad Laminate (CCL) suppliers helps to overcome material engineering problems
To ensure that all of our customer’s specifications are met or exceeded by our engineering services, manufacturing techniques, and quality systems.
  • Quality Manager is based in the US and works with our customers and factories to address quality concerns
  • Quality engineers in Asia to work with our US based quality manager to insure corrective action implementation
  • Bilingual capability to aide our factories in responding to corrective action requests
  • RMA and corrective action response handled by our US offices. RMA response within 24 hours (in most cases)
  • All factories are certified to ISO9001:2000 and most are certified to TS16949
  • Partnerships with third party laboratories to offer impartial root cause analysis
  • All of our factories supply ROHS compliant products
All of our factories are ISO 14001 certified, and audited regularly for proper waste disposal and environmental protection safeguards.